Difference between revisions of "2012 Summer Project Week:Deformable Registration for Head and Neck"
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Image:PW-MIT2012.png|[[2012_Summer_Project_Week#Projects|Projects List]] | Image:PW-MIT2012.png|[[2012_Summer_Project_Week#Projects|Projects List]] | ||
+ | Image:InitialIK.gif| Initial Alignment. | ||
+ | Image:PlastimatchIK.gif| Plastimatch registration. | ||
+ | Image:NiftyIK.gif| NiftyReg registration. | ||
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<h3>Approach, Plan</h3> | <h3>Approach, Plan</h3> | ||
− | + | We will apply state-of-the art deformable registration methods (elastix toolbox, SyN, ART, FNIRT) to this problem. The results will be used to understand if this problem can be solved with existing methods/what unsolved questions exist and which scenarios should be used in a test suite for comparing the above mentioned approaches. | |
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− | + | We have prepared typical registration scenarios of interest. | |
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==Delivery Mechanism== | ==Delivery Mechanism== | ||
− | This work will be delivered to the NA-MIC Kit as | + | This work will be delivered to the NA-MIC Kit as an |
#ITK Module | #ITK Module | ||
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==References== | ==References== | ||
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Latest revision as of 14:04, 22 June 2012
Home < 2012 Summer Project Week:Deformable Registration for Head and Neck
Key Investigators
- Georgia Tech: Ivan Kolesov
- MGH: Greg Sharp
- BWH: Yi Gao
- Boston University: Allen Tannenbaum
Objective
We are developing a method for full body (entire head and neck region), deformable, inter-patient registration for CT volumes. This problem is difficult because after rigid alignment is performed, large deformations are still present.
Approach, Plan
We will apply state-of-the art deformable registration methods (elastix toolbox, SyN, ART, FNIRT) to this problem. The results will be used to understand if this problem can be solved with existing methods/what unsolved questions exist and which scenarios should be used in a test suite for comparing the above mentioned approaches.
Progress
We have prepared typical registration scenarios of interest.
Delivery Mechanism
This work will be delivered to the NA-MIC Kit as an
- ITK Module